Cylindrical sputtering targets are used in PVD processes (coating by physical vapor deposition), for both horizontal and vertical applications.
By combining the rotating targets with our sputter hardware, an improved value creation model can be achieved (longer production runs, faster coating deposition, higher coating material utilization, etc.).
Custom-made solutions through partnerships with customers are developed to reach the required layer properties and to maximize sputter efficiency (in terms of target utilization and sputter yield).