Beki-Shield® BU

Beki-Shield® BU is a stainless steel filler material used in plastic compounds to provide electrical conductive properties. It comes in a continuous form supplied on bundles.  Our Beki-Shield® BU product can be used to create a master-batch which can be used to be integrated into a polymer matrix by both injection molding and by compounding techniques.

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Technical specifications

The following specifications describe the product in general form only. Specific technical details are provided with each individual order.

Codification:

BU ..... / .....  .....  ..... 
  a b c d
A Fiber diameter 8µm or 11µm
B Number of filaments 3000 – 20000 (multiples of 1000)
C Level of crimp No crimp (NCR) / Low crimp (LCR) / Crimp (CR) 
D Tube type B60 = Plastic spool
    KET = Cardboard tube
    BET = Plastic tube
  Alloy type SUS302  /  1.4310 (EN 10088-1)
  Standard weight 5 or 10 kg

Dosage information

Final Compounding

Volume % fibers Weight % fibers (*) Bulk resistivity (Ohm.cm) Performance (**)
0.25 - 0.50 4 < 10² ESD protection
1 8 0.5 - 2 30 - 50 dB EMI shielding
1.5 11 0.1 - 0.5 50 - 60 dB EMI shielding
> 1.5 > 11 < 0.1 > 60 dB EMI shielding

(*) resin density: ± 1 g/cm³ - stainless steel fiber density: ± 8 g/cm³
(**) 30-1000 MHz shielding range

Storage instructions

Packaging

Wood or synthetic packing material

Applications

Applications