Beki-Shield® BU is a stainless steel filler material used in plastic compounds to provide electrical conductive properties. It comes in a continuous form supplied on bundles. Our Beki-Shield® BU product can be used to create a master-batch which can be used to be integrated into a polymer matrix by both injection molding and by compounding techniques.
The following specifications describe the product in general form only. Specific technical details are provided with each individual order.
Codification:
| BU | ..... / | ..... | ..... | ..... |
|---|---|---|---|---|
| a | b | c | d |
| A | Fiber diameter | 8µm or 11µm |
|---|---|---|
| B | Number of filaments | 3000 – 20000 (multiples of 1000) |
| C | Level of crimp | No crimp (NCR) / Low crimp (LCR) / Crimp (CR) |
| D | Tube type | B60 = Plastic spool |
| KET = Cardboard tube | ||
| BET = Plastic tube | ||
| Alloy type | SUS302 / 1.4310 (EN 10088-1) | |
| Standard weight | 5 or 10 kg |
Final Compounding
| Volume % fibers | Weight % fibers (*) | Bulk resistivity (Ohm.cm) | Performance (**) |
|---|---|---|---|
| 0.25 - 0.50 | 4 | < 10² | ESD protection |
| 1 | 8 | 0.5 - 2 | 30 - 50 dB EMI shielding |
| 1.5 | 11 | 0.1 - 0.5 | 50 - 60 dB EMI shielding |
| > 1.5 | > 11 | < 0.1 | > 60 dB EMI shielding |
(*) resin density: ± 1 g/cm³ - stainless steel fiber density: ± 8 g/cm³
(**) 30-1000 MHz shielding range
